NAND Flash Testing Solution--eMMC Burn-in Socket/SD

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Basic Info

Place of Origin:	shenzhen, china

Product Description

1.Compatible solder ball & non-solder ball testing

2.Contacts with BeCu material

3.Open top design, easy to test automation.

4.Support hot drawing inserts, simultaneously supports through the SD.

5.Compatible:Toshiba, Samsung,Hynix, Intel,Sandisk etc4BIT,8BIT eMMC.

6.[U"contact support any type of solder ball shape and composition.

7.4-point pinch design for enhanced electrical contact.

8.Compact size and low actuation force.

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