DIP PCBA Board

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Basic Info

Place of Origin:	Shenzhen, China
Payment Type:	T/T

Product Description

DIP PCBA Board
Stencil size/range: 736 × 736mm
Min IC pitch: 0.30mm
Max PCB size: 410 × 360mm
Min PCB thickness: 0.35mm
Min chip size: 0201 (0.2 × 0.1)/0603 (0.6 x 0.3mm)
Max BGA size: 74 × 74mm
BGA ball pitch: 1.00mm (min), 3.00mm (max)
BGA ball diameter: 0.40mm (min), 1.00mm (max)
QFP lead pitch: 0.38mm (mini), 2.54mm (max)
Frequency of stencil cleaning: 1 time/5 to 10 pieces

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