OEM PCB Prototype
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Basic Info
| Place of Origin: | China |
|---|---|
| Payment Type: | T/T, Western Union |
Product Description
Product Description
OEM PCB Prototype:
Fulltronics now is running the turn-key solution to our customers, including boards, full component procurement, SMT/BGA/DIP assembly, mechanical/case assembly, IC programing, rubber molding, functional testing, inspection of finished goods to shipment arrangement.
Our assembly competence:
Stencil size/range: 736 × 736mm
Minimum IC pitch: 0.30mm
Maximum PCB size: 410 × 360mm
Minimum PCB thickness: 0.35mm
Minimum chip size: 0201 (0.2 × 0.1)/0603 (0.6 x 0.3mm)
Maximum BGA size: 74 × 74mm
BGA ball pitch: 1.00mm (minimum), 3.00mm (maximum)
BGA ball diameter: 0.40mm (minimum), 1.00mm (maximum)
QFP lead pitch: 0.38mm (minimum), 2.54mm (maximum)
Frequency of stencil cleaning: 1 time/5 to 10 pieces
We are ready to help you with whatever you may need.
Fulltronics now is running the turn-key solution to our customers, including boards, full component procurement, SMT/BGA/DIP assembly, mechanical/case assembly, IC programing, rubber molding, functional testing, inspection of finished goods to shipment arrangement.
Our assembly competence:
Stencil size/range: 736 × 736mm
Minimum IC pitch: 0.30mm
Maximum PCB size: 410 × 360mm
Minimum PCB thickness: 0.35mm
Minimum chip size: 0201 (0.2 × 0.1)/0603 (0.6 x 0.3mm)
Maximum BGA size: 74 × 74mm
BGA ball pitch: 1.00mm (minimum), 3.00mm (maximum)
BGA ball diameter: 0.40mm (minimum), 1.00mm (maximum)
QFP lead pitch: 0.38mm (minimum), 2.54mm (maximum)
Frequency of stencil cleaning: 1 time/5 to 10 pieces
We are ready to help you with whatever you may need.
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