Fulltronics Corporation Ltd.
Fulltronics Corporation Ltd.
China Professional Double-Sided PCB Manufacturing
  • China Professional Double-Sided PCB Manufacturing
China Professional Double-Sided PCB Manufacturing

China Professional Double-Sided PCB Manufacturing

Payment Type:
L/C, T/T, D/P, Paypal, Money Gram, Western Union
Quantity:

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Basic Info
Basic Info
Place of Origin: Shenzhen, China
Payment Type: L/C, T/T, D/P, Paypal, Money Gram, Western Union
Product Description
Product Description
OEM/ODM/EMS Services for PCBA:
PCBA, PCB Board assembly: SMT & PTH & BGA
PCBA and enclosure design
Components sourcing and purchasing
Quick prototyping
Plastic injection molding
Metal sheet stamping
Final assembly
Test: AOI, In-Circuit Test (ICT), Functional Test (FCT)
Custom clearance for material importing and product exporting
Capability - SMT
Lines 9(5 Yamaha, 4KME)
Capacity 52 million placements per month
Max Board Size 457*356mm. (18"X14")
Min Component size 0201-54 sq. Mm. (0.084 sq. Inch), long connector, CSP, BGA, QFP
Speed 0.15 sec/chip, 0.7 sec/QFP
Capability - PTH
Lines 2
Max board width 400 mm
Type Dual wave
Pbs status Lead-free line support
Max temp 399 degree C
Spray flux add-on
Pre-heat 3



If you need to get a formal quotation, please provide the spec as below:
1. PCB files in gerber file, . Pcb or. Pcbdoc formart
Please feel free to contact Fulltronics team. We are here ready to assist you with our professional skills and cheerful services

Stencil size/range:

736x736mm

Minimum IC pitch:

0.30mm

Maximum PCB size:

1200x 500mm

Minimum PCB thickness:

0.35mm

Minimum chip size:

0201 (0.2x0.1)/0603 (0.6 x 0.3mm)

Maximum BGA size:

74x74mm

BGA ball pitch:

1.00mm   (minimum), 3.00mm (maximum)

BGA ball diameter:

0.40mm   (minimum), 1.00mm (maximum)

QFP lead pitch:

0.38mm   (minimum), 2.54mm (maximum)

Frequency of stencil cleaning:

1 time/5 to 10 pieces

 

Turn Times:

Quick turn are our Specialty

Volume:

One piece to low valume production quantityes

Low cost first article builds

Schedule deliveries

Assembly type:

Surface mount(SMT) assembly

Thru-hole

Mixed(surface mount and thu-hole) technology

Single or double sided placement

Cable assembly

Components type:

Passive components:

As small as 0402 package

As small as 0201 with design review

Ball Grid Arrays(BGA):

As small as .5mm pitch

 

Stencil:

Laser cut stainless steel

Parts procurements:

Turnkey(we supply the parts)

Consigned(you supply the parts)

You supply some parts, we do the rest

Solder type:

Leaded

Lead-free/ROHS compliant

Other capabilities:

Repair/rework services

Mechanical assembly

Box build/electromechanical assembly

Mould and plastic injection.
 

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  • Mr. Daniel Wu

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