4 Layer PCB, Multilayer Impedance Control PCB

4 Layer PCB, Multilayer Impedance Control PCB, Immersion Gold

Layer:                              4
Material:                          FR4 Laminate, High Tg 170, RoHS compliance
PCB Thickness:              1.6mm+/-10%
Final Copper:                 1oz
Min Hole:                         0.25mm
Min line Width/Space:    5/5mil
Soldermask:                    Blue
Legend:                           White
Surface:                           Immersion Gold 
Outline:                            Rout and Score
E-Test:                             100%
 
Outgoing Reports:Final Inspection Report, E-Test Report, Solderability Test Report, Microsection Report and so on.
 
Inspection Standard:IPC-A-600H/IPC-6012B, Class 2/3
 
Certificates:UL, SGS, RoHS, ISO9001:2008, ISO14001:2004, ISO TS16949:2009


Shenzhen X-Mulong Circuit Co., Ltd is a professional Printed Circuit Board (PCB) manufacturer from China. We are specialized in providing fabrication service for Rigid PCB, Flex PCB, Rigid-Flex PCB and also Aluminum base PCB. Our market positioning is PCB solution provider for prototype, small volume and also medium volume orders. We focus very much on product quality and we have got IS09001-2008, ISO TS16949:2009 certificate for automotive industry on 6th June 2012.
 
The application fields of our products are various like: consumer electronics, industry, automotive, communication, IT, security, medical products and so on. For detail, we are able to produce PCB for TV, displayer, LED, LCD, washing machine, refrigerator, electronic scale, STB(Set Top Box), meter, industry controller/testing devices, power supply, computer,  modem, inverter, switch, sensor, CCTV, medical devices, automotive electronic accessories and so on. 

Factory  Manufacture  Capability
NO	ITEM	Techinical    capabilities
1	Materials	CEM-1  CEM-3  FR-4  High-TG  Teflon  Rogers  etc.
2	layers	1-16  layers
3	Min. core  material	5mil(excluding  copper)
4	Prepreg  type	7628  2116  1080  3313
5	Max. board  size	520*720mm
6	Copper  thickness	min. base  copper  1/3  OZ
		max. finished  copper6OZ
7	Min. board  thickness	2-  layer  10mil
		4-  layer  16mil
		6-layer    24mil
		8-layer    32mil
		10-layer  40mil
8	Max. board  thickness	236mil(finished  board  thickness)
9	Min. line  width/space	3mil/3mil  HOZ  copper  base(inner  layer)
10	Min. hole  size	8mil
11	PTH  wall  thickness	≥ 1mil
12	Hole  dia. tolerance	± 3mil
13	Hole  dia. tolerance	± 2mil
14	Countersink  hole	Min. depth(D)6mil; The  Depth  of  tolerance± 6mil
15	Drilling  hole  positional  deviation(outer  layer)	1st-drill  ± 3mil(Normal)  ± 2mil(min. )
		2nd-drill  ± 4mil
16	Min. solder  mask  bridge	3.2mil(HOZ  base  copper,   green)
17	Outline  tolerance	± 4mil
18	Twist  &   Bow	≤ 0.75%
19	Peelable  mask  thickness	≥ 8mil  1  printing
20	Insulation  Resistance	> 1012Ω   Normal
21	Through    hole resistance	< 300Ω   Normal
22	Current  breakdown	10A
23	Peel  strength	1.4N/mm
24	S/M  abrasion	> 6H
25	Thermal  stress	28  degrees  20Sec
26	Test  Voltage	20-300V
27	Min. blind/burried  via	8mil
28	Surface  finish	HAL  ENIG  IMAG  IMSN  OSP  HAL+G/F  ENIG+G/F
29	Impedance  control	Single  ended  impedance  50Ω /70Ω ± 10%  Normal
		Differential  impedance  90Ω /100Ω ± 10%  Normal
30	Max. aspect  ratio	12: 1