Immersion Gold PCB Assembly (OEM) for Power Bank/Battery Charger

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Basic Info

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Product Description

Layer count: 6

Major material: FR4

Board thickness: 1.6mm

Surface finishing: immersion gold

Solder mask: blue

Copper thickness: 1oz

Minimum hole size: 0.3mm

Minimum line width and spacing: 4mil

The following is the whole manufacturer capability:

Material:
- FR-4/Hi Tg FR-4/Lead-free
- Materials are compliant with RoHS Directive
- CEM-3, aluminium, metal based
Layer no.: 1-16
Finished board thickness: 0.2mm-3.5mm (8mil-138mil)
Board thickness tolerance: ±10%
Cooper thickness: 0.5oz-4oz (18um-144um)
Copper-plated hole: 18-40um
Impedance control: ±10%
Warp and twist: 0.70%
Image:
- Minimum trace width (a): 0.075mm (3mil)
- Minimum space width (b): 0.075mm (3mil)
- SMD pitch (a): 0.2mm (8mil)
- BGA pitch (b): 0.2mm (8mil)
Solder mask:
- Minimum solder mask dam (a): 0.0635mm (2.5mil)
- Solder mask clearance (b): 0.075mm (3mil)
- Minimum SMT pad spacing (c): 0.075mm (3mil)
- Solder mask thickness: 0.0007" (0.018mm)
Holes:
Minimum hole size (CNC): 0.2mm (8mil)
Minimum punch hole size: 0.9mm (35mil)
Hole size tol (+/-):
- PTH: ±0.075mm
- NPTH: ±0.05mm
Hole position tol: ±0.075mm
Plating:
- HASL/Lead-free HASL: 2.5um
- Immersion gold nickel: 3-7um
- Au: 1-5u''
OSP: 0.2-0.5um
Certificate: RoHS, ISO 9001:2008, SGS, UL