8-layer Board with Via Copper of 25.4μm, Used for Telecommunication

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Basic Info

Payment Type:	Telegraphic Transfer in Advance (Advance TT, T/T)

Product Description

Material: FR-4

Layer count: 8

Finish thickness: 1.7mm ±10%

Minimum width/spacing: 6/6mil

Minimum via diameter: 0.25mm

Via copper: 25.4μm

Surface finish: ENIG

Application: telecommunication

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