PCB with Eight Layers, 0.1mm Hole and 0.4 to 3.0mm Thickness

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Basic Info

Payment Type:	Telegraphic Transfer in Advance (Advance TT, T/T)

Product Description

Layers: 8

Base material: Fr4, CEM and high TG

Thickness: 0.4 to 3.0mm

Soldermask: green, black, red, yellow and white

Minimum line width: 0.075mm

Minimum line space: 0.075mm

Minimum hole diameter: 0.1mm

Maximum board size: 600 x 1200mm

Surface treatment: chemical gold, OSP, and HAL (LF)

Plating: tin/AU/Ni/Sn

Blind/buried via holes: okay

Certificates: UL, SGS, ISO:9001, and ISO:14001

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