4-layered Electronic Circuit PCB with FR4 Material, HASL Finish, Blind, Buired Vias for LED, Assembl

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Basic Info

Payment Type:	Telegraphic Transfer in Advance (Advance TT, T/T)

Product Description

Reference-our production capability for rigid PCB:

Layers: 1 to 28
Board finished thickness: 0.2 to 7.0mm
Materials: FR-4, CEM-1, CEM-3, high TG, FR4 halogen free andRogers
Finished board size: 23 x 25 (580 x 900mm) (maximum)
Drilled hole size: 3 mils (0.075mm) (minimum)
Line width: 3 mils (0.075mm) (minimum)
Line spacing: 3 mils (0.075mm) (minimum)
Surface finish/treatment: HASL/HASL lead free, HAL, chemicaltin and chemical gold, immersion silver/gold, OSP and goldplating
Copper thickness: 0.5 to 7.0oz
Solder mask colors: green/yellow/black/white/red/blue
Copper thickness in hole: >25.0μm (>1-mil)
Inner packing: vacuum packing/plastic bag
Outer packing: standard carton packing
Shape tolerance: ±0.13
Hole tolerance:
- PTH: ±0.076
- NPTH: ±0.05
Certificates: UL-SGS-RoHS-approved
Special requirements: buried and blind vias + controlledimpedance + BGA
Profiling: punching, routing, V-cut and beveling
Provides OEM services to all sorts of printed circuit boardassembly as well as electronic encased products

All trademarks shown here are for reference purposesonly. They are the property of their respective owners, and we arenot authorized to sell items bearing such trademarks.

Layers: 1 to 28

Board finished thickness: 0.2 to 7.0mm

Materials: FR-4, CEM-1, CEM-3, high TG, FR4 halogen free andRogers

Finished board size: 23 x 25 (580 x 900mm) (maximum)

Drilled hole size: 3 mils (0.075mm) (minimum)

Line width: 3 mils (0.075mm) (minimum)

Line spacing: 3 mils (0.075mm) (minimum)

Surface finish/treatment: HASL/HASL lead free, HAL, chemicaltin and chemical gold, immersion silver/gold, OSP and goldplating

Copper thickness: 0.5 to 7.0oz

Solder mask colors: green/yellow/black/white/red/blue

Copper thickness in hole: >25.0μm (>1-mil)

Inner packing: vacuum packing/plastic bag