Multilayered PCB with 1.6mm Thickness and 1 to 28 Layer Counts

Multilayered PCB with 1.6mm Thickness and 1 to 28 Layer Counts

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Basic Info

Payment Type:	Cash in Advance (CID

Product Description

Our fabrication capacity for rigid PCB:

Layer counts: 1 to 28
Board finished thickness: 0.21mm to 7.0mm
Materials: FR-4, CEM-1, CEM-3, high TG, FR4 halogen free,rogers
Maximum finished board size: 23 x 25mm
Minimum drilled hole size: 3mil (0.075mm)
Minimum line width: 3mil (0.075mm)
Minimum line spacing: 3mil (0.075mm)
Surface finish/treatment: HASL/HASL lead free, HAL, chemicaltin, chemical gold, immersion silver/gold, OSP, gold-plated
Copper thickness: 0.5 to 7.0OZ
Solder mask color: green/yellow/black/white/red/blue
Copper thickness in hole: >25.0um (>1mil)
Inner packing: vacuum packing/plastic bag
Outer packing: standard carton packing
Shape tolerance: ±0.13
Hole tolerance: PTH: ±0.076, NPTH: ±0.05
Certificate: UL, ISO 9001, ISO 14001
Special requirements: buried and blind vias + controlledimpedance + BGA
Profiling: punching, routing, V-CUT, beveling
Provides OEM services to all sorts of printed circuit boardassembly as well as electronic encased products

Disclaimer: All brands and trademarks shown here areonly for references. We are not authorized to sell any productsbearing such trademarks and brands.

Layer counts: 1 to 28

Board finished thickness: 0.21mm to 7.0mm

Materials: FR-4, CEM-1, CEM-3, high TG, FR4 halogen free,rogers

Maximum finished board size: 23 x 25mm

Minimum drilled hole size: 3mil (0.075mm)

Minimum line width: 3mil (0.075mm)

Minimum line spacing: 3mil (0.075mm)

Surface finish/treatment: HASL/HASL lead free, HAL, chemicaltin, chemical gold, immersion silver/gold, OSP, gold-plated

Copper thickness: 0.5 to 7.0OZ

Solder mask color: green/yellow/black/white/red/blue

Copper thickness in hole: >25.0um (>1mil)

Inner packing: vacuum packing/plastic bag