HD/Circuit/Multilayer PCB, Material of FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers

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Basic Info

Payment Type:	Telegraphic Transfer (TT,T/T)

Product Description

Layer counts: 8-layer

Minimum driller size: 0.1mm

Minimum LW/LS: 3/3-mil

Surface technique: immersion gold

Our fabrication capacity for PCB:

Layer counts: 1 to 28
Board finished thickness: 0.21 to 7.0mm
Materials: FR-4, CEM-1, CEM-3, high TG, FR4 Halogen free,Rogers
Maximum finished board size: 23 × 25mm (580mm)
Minimum drilled hole size: 3-mil (0.075mm)
Minimum line width: 3-mil (0.075mm)
Minimum line spacing: 3-mil (0.075mm)
Surface finish/treatment : HASL / HASL lead free, HAL, chemicaltin, chemical gold, immersion silver/gold, OSP and goldplating
Copper thickness: 0.5 to 7.0oz
Solder mask color: green/yellow/black/white/red/blue
Copper thickness in hole: >25.0um (>1-mil)
Inner packing: vacuum packing/plastic bag
Outer packing: standard carton packing
Shape tolerance: ±0.13
Hole tolerance:
- PTH: ±.076
- NPTH: ±.05
Certificate: UL
Special requirements: buried and blind vias + controlledimpedance + BGA
Profiling: punching, routing, V-CUT, bevelling
Provides OEM services to all sorts of printed circuit boardassembly as well as electronic encased products

Disclaimer: All trademarks shown here are for referencepurposes only. They are the property of their respective owners,and we are not authorized to sell items bearing suchtrademarks.

Layer counts: 1 to 28

Board finished thickness: 0.21 to 7.0mm

Materials: FR-4, CEM-1, CEM-3, high TG, FR4 Halogen free,Rogers

Maximum finished board size: 23 × 25mm (580mm)

Minimum drilled hole size: 3-mil (0.075mm)

Minimum line width: 3-mil (0.075mm)

Minimum line spacing: 3-mil (0.075mm)

Surface finish/treatment : HASL / HASL lead free, HAL, chemicaltin, chemical gold, immersion silver/gold, OSP and goldplating

Copper thickness: 0.5 to 7.0oz

Solder mask color: green/yellow/black/white/red/blue

Copper thickness in hole: >25.0um (>1-mil)

Inner packing: vacuum packing/plastic bag