PCB Assembly with SND and DIP Assembly Process, Made of FR4 Material

1.0mm 4-layers PCB with Keystoke, 5/5mil Line Width or Space, Hard and Soft Gold

PCB Assembly for Bluetooth Headset, 20/15/12 Mils Pitch and 0402 Placement

1.6mm 4-layer PCB with Lead Free SMOBC and HASL Finishes, 50μm Maximum Hard Gold Thickness

4-layers PCB with 0.8mm Thickness, Blue Solder Mask and Immersion Gold, Measures 1,000 x 1,200mm

FR4 TG180 1.6mm 6-layer PCB with Immersion Gold Finish, Suitable for Industry Test and Control