Chengxi Technology (Hong Kong) Company Limited
Chengxi Technology (Hong Kong) Company Limited
FR4 Basis PCB & PCB Laminate with Double Sided Board and HAL Lead-free, 1.6mm, 1oz Copper Thickness
  • FR4 Basis PCB & PCB Laminate with Double Sided Board and HAL Lead-free, 1.6mm, 1oz Copper Thickness
FR4 Basis PCB & PCB Laminate with Double Sided Board and HAL Lead-free, 1.6mm, 1oz Copper Thickness

FR4 Basis PCB & PCB Laminate with Double Sided Board and HAL Lead-free, 1.6mm, 1oz Copper Thickness

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Basic Info
Basic Info
Payment Type: Telegraphic Transfer (TT,T/T)
Product Description
Product Description
  • Ultrasonic FR-4 TG 130℃ base material
  • Thickness: 1.6mm
  • Copper thickness: 1/1/1/1oz
  • Min hole size: 0.2mm
  • Solder mask with blind
  • Line width/line space: 3/3 mils
  • Surface finish: immersion gold
  • Green solder mask, white silkscreen, solder mask control
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