Jasecen International (HK) Co. Ltd
Products
Products
Jasecen International (HK) Co. Ltd
10-layer PCB with 3Oz inner layer and 4Oz copper outer layer
  • 10-layer PCB with 3Oz inner layer and 4Oz copper outer layer
10-layer PCB with 3Oz inner layer and 4Oz copper outer layer

10-layer PCB with 3Oz inner layer and 4Oz copper outer layer

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Basic Info
Basic Info
Payment Type: T/T or Western Union
Product Description
Product Description
  • Material: FR-4 tg170
  • Board thickness: 2.0mm
  • Surface finish: immersion tin
  • Minimum through hole: 0.2mm
  • Minimum line width: 0.25mm
  • Minimum line space: 0.25mm
  • Special requirements: controlled impedance
  • Board types:
    • Multilayer rigid PCB's up to 18 layers
    • Flexible and flex-rigid circuits up to 18 layers
    • Controlled impedance
    • HDI (high density interconnect)
    • Blind and buried via holes
  • RoHS directive-compliant
  • Certification: UL
  • Substrates:
    • FR4 standard epoxy and high temp versions
    • Polyimide, polyester and PET
    • PTFE (polytetrafluoroethylene) and Duriod (glass reinforced PTFE composite)
    • Aluminium based materials
    • Ceramic and exotic substrates with higher maximum operating temperatures, lower coefficients of expansion and/or higher Tg levels
  • Board options:
    •  CNC routing
    •  Scoring (V-Grooving)
    •  Gold on nickel contact fingers
    •  LPSM (liquid photoimageable solder mask) range of colors are available
    •  Peel-able solder mask
    •  Screened conductive inks (carbon)
    •  Bare board electrical testing
  • Board finishes:
    • Immersion silver
    • Immersion gold
    • Lead free or HASL (hot air solder leveling)
    • OSP (organic surface preservative)
    • Gold finger
    • Plating gold
    • Immersion tin
  • We also offer:
    • PCB design
    • Circuit layout and drafting
    • PCB copy
  • Multilayer rigid PCB's up to 18 layers
  • Flexible and flex-rigid circuits up to 18 layers
  • Controlled impedance
  • HDI (high density interconnect)
  • Blind and buried via holes
  • FR4 standard epoxy and high temp versions
  • Polyimide, polyester and PET
  • PTFE (polytetrafluoroethylene) and Duriod (glass reinforced PTFE composite)
  • Aluminium based materials
  • Ceramic and exotic substrates with higher maximum operating temperatures, lower coefficients of expansion and/or higher Tg levels
  •  CNC routing
  •  Scoring (V-Grooving)
  •  Gold on nickel contact fingers
  •  LPSM (liquid photoimageable solder mask) range of colors are available
  •  Peel-able solder mask
  •  Screened conductive inks (carbon)
  •  Bare board electrical testing
  • Immersion silver
  • Immersion gold
  • Lead free or HASL (hot air solder leveling)
  • OSP (organic surface preservative)
  • Gold finger
  • Plating gold
  • Immersion tin
  • PCB design
  • Circuit layout and drafting
  • PCB copy

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