Shenzhen Ledor Optoelectronics Co. Ltd
Shenzhen Ledor Optoelectronics Co. Ltd
LD 18W ODM Aluminum PCB for Downlights with Samsung 5630 SMD Chip, 10 to 300V Test VoltageNew
  • LD 18W ODM Aluminum PCB for Downlights with Samsung 5630 SMD Chip, 10 to 300V Test VoltageNew
  • LD 18W ODM Aluminum PCB for Downlights with Samsung 5630 SMD Chip, 10 to 300V Test VoltageNew
  • LD 18W ODM Aluminum PCB for Downlights with Samsung 5630 SMD Chip, 10 to 300V Test VoltageNew
  • LD 18W ODM Aluminum PCB for Downlights with Samsung 5630 SMD Chip, 10 to 300V Test VoltageNew
  • LD 18W ODM Aluminum PCB for Downlights with Samsung 5630 SMD Chip, 10 to 300V Test VoltageNew
  • LD 18W ODM Aluminum PCB for Downlights with Samsung 5630 SMD Chip, 10 to 300V Test VoltageNew
  • LD 18W ODM Aluminum PCB for Downlights with Samsung 5630 SMD Chip, 10 to 300V Test VoltageNew
  • LD 18W ODM Aluminum PCB for Downlights with Samsung 5630 SMD Chip, 10 to 300V Test VoltageNew
LD 18W ODM Aluminum PCB for Downlights with Samsung 5630 SMD Chip, 10 to 300V Test VoltageNew
LD 18W ODM Aluminum PCB for Downlights with Samsung 5630 SMD Chip, 10 to 300V Test VoltageNew
LD 18W ODM Aluminum PCB for Downlights with Samsung 5630 SMD Chip, 10 to 300V Test VoltageNew
LD 18W ODM Aluminum PCB for Downlights with Samsung 5630 SMD Chip, 10 to 300V Test VoltageNew
LD 18W ODM Aluminum PCB for Downlights with Samsung 5630 SMD Chip, 10 to 300V Test VoltageNew
LD 18W ODM Aluminum PCB for Downlights with Samsung 5630 SMD Chip, 10 to 300V Test VoltageNew
LD 18W ODM Aluminum PCB for Downlights with Samsung 5630 SMD Chip, 10 to 300V Test VoltageNew
LD 18W ODM Aluminum PCB for Downlights with Samsung 5630 SMD Chip, 10 to 300V Test VoltageNew

LD 18W ODM Aluminum PCB for Downlights with Samsung 5630 SMD Chip, 10 to 300V Test VoltageNew

Payment Type:
T/T, Cash
Quantity:

Your message must be between 20 to 2000 characters

Contact Now
Basic Info
Basic Info
Payment Type: T/T, Cash
Product Description
Product Description
  • Specifications:
    • Layers: 1 to 2
    • Thickness: 0.6-3.0mm
    • Thermal conductivity: 1.0-3.0 C/W
    • Materials: FR-4, aluminum
    • Surface finishing: HASL, immersion gold, silver and OSP
    • Soldermask types: white, black
    • Finishing board thickness: 0.2 to 3.2mm
    • Certifications: UL, RoHS
    • Copper thickness: 35 to 70um
    • Copper plating hole: 18 to 40um
    • Trace width and line spacing: 0.1mm
    • Maximum panel dimensions: 610 x 1200mm
    • Hole position tolerance: 0.075mm
    • Hole dimension tolerance: 0.05mm
    • Outline tolerance: 0.1mm
    • Warp and twist: ≤0.70%
    • Minimum soldermask bridge: 0.0635mm
    • Minimum distance between line to board bridge: 0.1mm
    • Impedance control tolerance: ±5%
    • Test voltage: 10 to 300V
  • Layers: 1 to 2
  • Thickness: 0.6-3.0mm
  • Thermal conductivity: 1.0-3.0 C/W
  • Materials: FR-4, aluminum
  • Surface finishing: HASL, immersion gold, silver and OSP
  • Soldermask types: white, black
  • Finishing board thickness: 0.2 to 3.2mm
  • Certifications: UL, RoHS
  • Copper thickness: 35 to 70um
  • Copper plating hole: 18 to 40um
  • Trace width and line spacing: 0.1mm
  • Maximum panel dimensions: 610 x 1200mm
  • Hole position tolerance: 0.075mm
  • Hole dimension tolerance: 0.05mm
  • Outline tolerance: 0.1mm
  • Warp and twist: ≤0.70%
  • Minimum soldermask bridge: 0.0635mm
  • Minimum distance between line to board bridge: 0.1mm
  • Impedance control tolerance: ±5%
  • Test voltage: 10 to 300V
  • Send your message to this supplier

    • Enter between 20 to 4,000 characters.

    Related Keywords

    Related Keywords