Shenzhen Ledor Optoelectronics Co. Ltd
Shenzhen Ledor Optoelectronics Co. Ltd
LD 200W ODM Aluminum PCB for High Bay Lights with Lite-on 3030 SMD Chip
  • LD 200W ODM Aluminum PCB for High Bay Lights with Lite-on 3030 SMD Chip
  • LD 200W ODM Aluminum PCB for High Bay Lights with Lite-on 3030 SMD Chip
  • LD 200W ODM Aluminum PCB for High Bay Lights with Lite-on 3030 SMD Chip
  • LD 200W ODM Aluminum PCB for High Bay Lights with Lite-on 3030 SMD Chip
  • LD 200W ODM Aluminum PCB for High Bay Lights with Lite-on 3030 SMD Chip
  • LD 200W ODM Aluminum PCB for High Bay Lights with Lite-on 3030 SMD Chip
  • LD 200W ODM Aluminum PCB for High Bay Lights with Lite-on 3030 SMD Chip
  • LD 200W ODM Aluminum PCB for High Bay Lights with Lite-on 3030 SMD Chip
LD 200W ODM Aluminum PCB for High Bay Lights with Lite-on 3030 SMD Chip
LD 200W ODM Aluminum PCB for High Bay Lights with Lite-on 3030 SMD Chip
LD 200W ODM Aluminum PCB for High Bay Lights with Lite-on 3030 SMD Chip
LD 200W ODM Aluminum PCB for High Bay Lights with Lite-on 3030 SMD Chip
LD 200W ODM Aluminum PCB for High Bay Lights with Lite-on 3030 SMD Chip
LD 200W ODM Aluminum PCB for High Bay Lights with Lite-on 3030 SMD Chip
LD 200W ODM Aluminum PCB for High Bay Lights with Lite-on 3030 SMD Chip
LD 200W ODM Aluminum PCB for High Bay Lights with Lite-on 3030 SMD Chip

LD 200W ODM Aluminum PCB for High Bay Lights with Lite-on 3030 SMD Chip

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Basic Info
Basic Info
Payment Type: T/T, Cash
Product Description
Product Description
  • Layer count: 1 to 2
  • Thickness: 0.6-3.0mm
  • Thermal conductivity: 1.0-3.0C/W
  • Materials: FR-4, aluminum
  • Surface finishing: HASL, immersion gold, immersion silver and OSP
  • Solder mask types: white, black
  • Finish board thickness: 0.2 to 3.2mm
  • Certifications: UL, RoHS
  • Copper thickness: 35 to 70um
  • Copper plating hole: 18 to 40um
  • Trace width and line spacing: 0.1mm
  • Maximum panel dimensions: 610 x 1,200mm
  • Hole position tolerance: 0.075mm
  • Hole dimension tolerance:0.05mm
  • Outline tolerance: 0.1mm
  • Warp and twist: ≤0.70%
  • Minimum solder mask bridge: 0.0635mm
  • Minimum distance between line to board bridge: 0.1mm
  • Impedance control tolerance: ±5%
  • Test voltage: 10 to 300V
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