Modulelink (Shenzhen) Technology Co. Ltd
Modulelink (Shenzhen) Technology Co. Ltd
SFP BIDI 1490nm/1310nm 1.25Gbps Module LC, 10KM
  • SFP BIDI 1490nm/1310nm 1.25Gbps Module LC, 10KM
  • SFP BIDI 1490nm/1310nm 1.25Gbps Module LC, 10KM
SFP BIDI 1490nm/1310nm 1.25Gbps Module LC, 10KM
SFP BIDI 1490nm/1310nm 1.25Gbps Module LC, 10KM

SFP BIDI 1490nm/1310nm 1.25Gbps Module LC, 10KM

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Telegraphic Transfer in Advance (Advance TT, T/T)
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Basic Info
Basic Info
Payment Type: Telegraphic Transfer in Advance (Advance TT, T/T)
Product Description
Product Description
  • Features:
    • Up to 1.25 Gb/s bi-directional data links
    • Hot-pluggable SFP footprint
    • 1310nm FP Transmitter and 1490nm PIN Receiver for MSFP-1.25G-BIDI10-R
    • 1490nm DFB Transmitter and 1310nm PIN Receiver for MSFP-1.25G-  BIDI10-T
    • Single LC connector 
    • Low power dissipation
    • Metal enclosure, for lower EMI 
    • Up to 10km point to point transmission
    • Single 3.3V power supply 
    • Operating temperature range: 0 to 70 deg. C
  • Applications: 
    • 1.25Gb/s Gigabit Ethernet
    • Point-to-point FTTX Application
  • Up to 1.25 Gb/s bi-directional data links
  • Hot-pluggable SFP footprint
  • 1310nm FP Transmitter and 1490nm PIN Receiver for MSFP-1.25G-BIDI10-R
  • 1490nm DFB Transmitter and 1310nm PIN Receiver for MSFP-1.25G-  BIDI10-T
  • Single LC connector 
  • Low power dissipation
  • Metal enclosure, for lower EMI 
  • Up to 10km point to point transmission
  • Single 3.3V power supply 
  • Operating temperature range: 0 to 70 deg. C
  • 1.25Gb/s Gigabit Ethernet
  • Point-to-point FTTX Application
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