4G TDD LTE Mini PCIE Module Wireless Card with Qualcomm Chipset, Measures 36.5 x 50.95 x 4.35mm

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Basic Info

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Product Description

LTE TDD Cat3 DC-HSPA+/HSUPA/HSDPA/UMTS

TDD LTE: B38, B40 (optional)

HSPA+/UMTS: 850/900/2,100MHz (optional)

TDD LTE: download up to 68Mbps, upload up to 17Mbps

WCDMA/UMTS: download up to 42Mbps, upload up to 5.76Mbps

Supported SMS, AT command, NDIS (packet data), RX diversity

Full mini PCI express 52-pin, USB2.0, 1.8/3V SIM interface

OS support: Microsoft's Windows 8/7/Vista/XP, Linux

Dimensions: 36.5*50.95*4.35mm

Temperature range: -20 to +60℃ (operating)/-30 to +80℃ (storage)

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