Topscom Precision Industry Co Limited
Products
Products
Topscom Precision Industry Co Limited
PCB Assembly with OEM/ODM, High-speed SMT and DIP AssemblyNew
  • PCB Assembly with OEM/ODM, High-speed SMT and DIP AssemblyNew
  • PCB Assembly with OEM/ODM, High-speed SMT and DIP AssemblyNew
  • PCB Assembly with OEM/ODM, High-speed SMT and DIP AssemblyNew
  • PCB Assembly with OEM/ODM, High-speed SMT and DIP AssemblyNew
  • PCB Assembly with OEM/ODM, High-speed SMT and DIP AssemblyNew
PCB Assembly with OEM/ODM, High-speed SMT and DIP AssemblyNew
PCB Assembly with OEM/ODM, High-speed SMT and DIP AssemblyNew
PCB Assembly with OEM/ODM, High-speed SMT and DIP AssemblyNew
PCB Assembly with OEM/ODM, High-speed SMT and DIP AssemblyNew
PCB Assembly with OEM/ODM, High-speed SMT and DIP AssemblyNew

PCB Assembly with OEM/ODM, High-speed SMT and DIP AssemblyNew

Get Latest Price
Payment Type:
TT or L/C at Sight
Quantity:

Your message must be between 20 to 2000 characters

Contact Now
Basic Info
Basic Info
Payment Type: TT or L/C at Sight
Product Description
Product Description
  • Features:
    • Plastic molding and injection
    • Sheet metal stamping and punching
    • Painting lines
    • Die-casting lines
    • Powder coating lines
    • Silkscreen and pad printing
    • High-speed SMT and DIP assembly
  • Capable of providing cost effective and high-quality vertical manufacturing services from PCB assembly to final case assembly:
    • Chip-on-board (COB)
    • Surface-mount technology (SMT)
    • Ball-grid array (BGA)
    • Through-hole
  • Primary competitive advantages:
    • Profound knowledge of contract manufacturing services
    • Capable of developing effective production process to ensure high-quality and consistency
    • Experienced logistics management
    • Cost-effective factory located in mainland China
    • Able to handle small as well as large volume production with flexibility
  • Plastic molding and injection
  • Sheet metal stamping and punching
  • Painting lines
  • Die-casting lines
  • Powder coating lines
  • Silkscreen and pad printing
  • High-speed SMT and DIP assembly
  • Chip-on-board (COB)
  • Surface-mount technology (SMT)
  • Ball-grid array (BGA)
  • Through-hole
  • Profound knowledge of contract manufacturing services
  • Capable of developing effective production process to ensure high-quality and consistency
  • Experienced logistics management
  • Cost-effective factory located in mainland China
  • Able to handle small as well as large volume production with flexibility

    • Send your message to this supplier

    • Mr.  Frank of OEM I Factory

    • Enter between 20 to 4,000 characters.

    Related Products

    Related Keywords

    Related Keywords
    Related Products
    Product Categories