FZ-PCB TECHNOLOGY CO., LIMITED
FZ-PCB TECHNOLOGY CO., LIMITED
Rigid PCB and PCBA Assembly
  • Rigid PCB and PCBA Assembly
Rigid PCB and PCBA Assembly

Rigid PCB and PCBA Assembly

Payment Type:
T/T, Paypal, Western Union
Quantity:

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Basic Info
Basic Info
Place of Origin: Shenzhen, China
Payment Type: T/T, Paypal, Western Union
Product Description
Product Description
Reliable and stable quality with more than 12 years pcb manufacturing experience.
Quick response & 24 hours available service.
Professional sales service & advice.
Fulfillment of our promises, NO lies.
Protecting your Intellectual property. All our staff of trained professionals are working under a strict confidential contract.

Market Segment
Rigid PCB and PCBA AssemblyRigid PCB and PCBA AssemblyFactory glance

Rigid PCB and PCBA Assembly
 PCBA Capabilities included
·Components procerement, PCB and accessories manufacturing, PCB Assembly, mechanical and final assembly, Electronic testing and function testing.

·High precision0402, 0603, 0805, 1210 and 2512; fine pitch QFP(0.3mm), BGA(0.5mm), IC(0.3mm) bonding size components SMT technology and lead free RoHS technology.

·Circuit boards with 1 to 8 layers PCB layout, modification, fabrication, plastics, metal box building, final assembly and testing.

·ISO 9001-2000 certification and elevator safety report.

PCBA building experience range

·Industrial elevator system, digital video record (DVR) system, medical, computing, storage, instrumentation, traffic, industrial power, fire alarm, wireless communication, telecommunication, networking and house controller. 

Package & Shipping Method:
1. Vacuum package with silica gel, Carton box with packing belt.
2. By DHL, UPS, FedEx, TNT
3. By EMS (Usually for Russia Clients)
4. By sea for mass quantity according to customer's requirement
 
Payment method
1.     T/T
2.     Paypal
3.     Western Union


Files Gerber, Protel, Powerpcb, Autocad, Orcad, etc
Material FR-4, Hi-Tg FR-4, Lead free Materials (RoHS Compliant) , FR1, CEM-3, CEM-1, Aluminium, High frequency Material (Rogers, Teflon, Taconic), Polymide.
Layer No. 1 - 16 Layers
Board thickness 0.0075"(0.2mm)-0.125"(3.2mm) 
Board Thickness Tolerance ±10%
Copper thickness 0.3OZ - 4OZ
Impedance Control ±10%
Warp and Twist ≤0.075%
Peel Strength ≥61B/in(≥107g/mm)
Min Trace Width (a) 3mil
Min Space Width (b) 3mil
Min Annular Ring 0.004"(0.1mm)
SMD Pitch (a) 0.012"(0.3mm)
pcb with green solder mask and LF-FREE surface finishing BGA Pitch (b) 0.027"(0.675mm)
Register tolerance 0.05mm
Min Solder Mask Dam (a) 0.005"(0.125mm)
Solder mask Clearance (b) 0.005"(0.125mm)
Min SMT Pad spacing (c) 0.004"(0.1mm)
Solder Mask Thickness 0.0007"(0.018mm)
Hole size 0.008"(0.20mm)-- 0.257"(6.5mm)
Hole Size Tol (+/-) ±0.003"(±0.0762mm)
Max PTH Aspect Ratio 10:1
Hole Registration 0.003"(0.075mm)
HASL 2.5um
Lead free HASL 2.5um
Immersion Gold Nickel  3-7um  Au:1-3u''
OSP 0.2-0.5um
Panel Outline Tol (+/-) ±0.004''(±0.1mm)
Beveling 30°45°
V-cut 15° 30° 45° 60°
Surface finish HAL, HASL Lead Free, Immersion gold, Gold plating, Gold finger, immersion silver, immersion Tin, OSP, Carbon ink,
Certificate  ROHS  ISO9001 TS16949  SGS  UL
Special requirements Buried&blind vias, Impedance control, via plug, BGA soldering and gold finger

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