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Product Description

XCE PCB technical specifications
Annual stock Material	Rogers,Taconic,Arton,Isola,F4B,TP-2.FR-4,High TG,Halogen free
Layer No.	1~16
Min board thickness	2 layer0.2mm 4 layer0.4mm 6 layer 0.6mm 8 layer 0.8mm 10 layer 1.0mm
Max panel size	508*610mm
Board thickness tolerance	T≥0.8mm±8%.,T<0.8mm±5%
Wall hole copper thickness	>0.025mm(1mil)
Finished hole	0.2mm-6.3mm
Min line width	4mil/4mil(0.1/0.1mm)
Min bonding pad space	0.1mm(4mil)
PTH aperture tolerance	±0.075mm(3mil)
NPTH aperture tolerance	±0.05mm(2mil)
Hole site deviation	±0.05mm(2mil)
Profile tolerance	±0.10mm(4mil)
Board bend&warp	≤0.7%
Insulation resistance	>1012Ωnormal
Through-hole resistance	<300Ωnormal
Electric strength	>1.3kv/mm
Current breakdown	10A
Peel strength	1.4N/mm
Soldmask regidity	>6H
Thermal stress	288℃20Sec
Testing voltage	50-300V
Min buried blind via	0.2mm(8mil)
Outer copper thickness	1oz-5oz
Inner cooper thickness	1/2 oz-4oz
Aspect ratio	8:1
SMT min green oil width	0.08mm
Min green oil open window	0.05mm
Insulation layer thickless	0.075mm-5mm
Taphole aperture	0.2mm-0.6mm
Special technology	Indepedance,Blind buried via,thick gold,aluminum PCB
Surface finish	HASL,Lead free HASL,Immersion Gold, Immersion Tin, Immersion Silver,OSP ,ENIG ,Golden finger,Blue glue,Gold plating

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