PCB Design And Fabrication 10 Layer Bga Tg170 Gold Finger
- Min. Order:
- 1
- Min. Order:
- 1
- Delivery Time:
- 30 Days
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Contact Now| Place of Origin: | China |
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PCB Design And Fabrication 10 Layer Bga Tg170 Gold Finger Hole Size 0.2mm
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Product Description |
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Model Number: |
CTEL1010200 |
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Number of Layer: |
10Layer |
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Material: |
FR4 tg170 |
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Finish Thickness: |
2.4mm |
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copper: |
1oz |
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PCB Size : |
55*109mm |
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Line Width/line space |
10/8mil |
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Min.Hole size : |
0.2mm |
| Surface finish : | Gold finger |
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Green solder mask |
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White sillkscreen |
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Place of Origin: |
China |
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Brand Name: |
ChiTun |
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Certification: |
UL,ROHS,ISO |
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Standard: |
IPC standard |
TECHNOLOGY:
. RoHS/ Lead Free
. HDI Microvias
. Blind Vias
. Buried Vias
. Selective Plating
. Impedance Control
Manufacturing Standard:
. IPC-A-600G Class II
. IPC-A-600G Class III
. PERFAG 2E for Double-Sided Board
. PERFAG 3C for Multilayer Board
Capability
Min. Finished Holes Size: 0.008" (0.20mm)
Micro vias diameter: 0.004 TO 0.010 inches (0.10 - 0.25mm)
Minimum line width/spacing: 0.004/0.004 inches (0.10mm/ 0.10mm)
Maximum copper thickness: 5oz (140um)
Thin board thickness:
. DS - 0.008 inches (0.20mm)
. 4/L - 0.016 (0.40mm)
. 6/L - 0.020 inches (0.60mm)
Maximum board thickness:
. 275.8mil (7.0mm)
Surface treatment:
. HASL/lead free HAL/gold plating
. Immersion gold
. Immersion tin
. Immersion silver
. Gold fingers (hard gold)
. OSP
