500g per no clean lead solder paste for screen stencil printing

500g per no clean lead solder paste for screen stencil printing Solder Paste Introduction:         Solder paste is prepared by kneading solder powder and solder flux and is used for surface mounting PC boards. Best Alloys solder paste is a combination of solder powder without oxidation in a uniform particle size and flux with excellent chemical stability. Our paste features excellent properties such as high reliability, good preservation stability, excellent solderability, and low generation of microscopic solder ball.   Low Temperature Solder Paste Specifications:   Alloy Composition:   Sn42Bi58 Melting Point:  139°C Powder Size:  Type3: 25-45 µ m Product standard:  (1) Packing:  500G/bottle, 10KG/box   500G/bottle, 10KG/box 
                                     (2) EPMC:  In full compliance with EU RoHS instructions requirements
                                     (3)  Store:  Six months in 0~10°C    Low Temperature Solder Paste Major Features:   Excellent wettability and solderability; Transparent residue and low solder ball rate; Keep the stability in tackiness force of solder paste over 24hr.; No change in viscosity during continuous printing; Good spreading and bright solder joint. Usage: Suitable for re-flow soldering   Detailed Description of the Solder Paste:                 Our products had adopted ISO9001:2008 Quality System Authorities and SGS inspection, and all lead-free items conform to ROHS standard!       At present, we have customers in Canada, Germany, United States and Asia.         - High bonding and insulating properties
- Perfect for precision DIY projects such as cell phone, computer parts, chips, etc
- Made from USA AMT original material