Bingri Electronic Technology (Shenzhen) Co., Ltd.
Bingri Electronic Technology (Shenzhen) Co., Ltd.
LED Package Lamp Beads 3535
  • LED Package Lamp Beads 3535
LED Package Lamp Beads 3535

LED Package Lamp Beads 3535

Transportation:
Air
Quantity:

Your message must be between 20 to 2000 characters

Contact Now
Basic Info
Basic Info
Place of Origin: China
Payment Type: T/T
Incoterm: FOB
Certificate: ISO9001;IATF16949
Transportation: Air
Product Description
Product Description


                                                       LED Package Lamp Beads 3535

Our store adheres to the tenet of integrity management, quality first, customer first, and attentive service. I believe that as long as you work hard, there is no problem that cannot be solved. Therefore, if any product purchased in this store has a dispute, please communicate with customer service patiently. We must take care of everything for you. Our products are all factory genuine, routinely produced, and available all year round. Unauthorized use of our products will be pursued to the end.



  • Features

       * Emitted Color: UVC 

        * Lens Appearance: Clean quartz lens

        * Dimensions:3.5*3.5mm 
        * Power
:25-30mW 
        * Optical Angle
:60 degree
        * Current
:150mA 
        * Voltage
:6.5V 
        * Wavelengths: 270-280nm 

  • Applications

        1.Sterilize



  • Soldering:



        1. Manual Soldering
        The temperature of the iron tip should not be higher than 350℃and Soldering time to be within 3 seconds per
        solder-pad.
        2. Reflow Soldering
        Preheating : 140℃~160℃±5℃,within 2 minutes.
        Operation heating : 260℃(Max.) within 10 seconds.(Max)

        Gradual Cooling (Avoid quenching)

huiliuhang



  • Storage



        In order to avoid the absorption of moisture, it is recommended to solder BINGRI LEDs as soon as possible after
        unpacking the sealed envelope.
        If the envelope is still packed, to store it in the environment as following:
          (1)Temperature : 5℃-30℃(41℉)Humidity : RH 60﹪Max.
          (2)After this bag is opened, devices that will be applied to infrared reflow, vapor-phase reflow, or equivalent
              soldering process must be:
              a. Completed within 168 hours.
              b. Stored at less than 30% RH.
        (3)Devices require baking before mounting, if:
             (2) a or (2) b is not met.
        (4)If baking is required, devices must be baked under below conditions:
               48 hours at 60℃±3℃





  • Tapping and packaging specifications (Units: mm)


Tapping and packaging specifications





* Widely used in surface sterilization,air sterilization,water sterilization,and has a high usage rate in biomedicine.


Send your message to this supplier

  • Mr. Huang

  • Enter between 20 to 4,000 characters.