
TSIM Series 1.85mm Height Connector
- Payment Type:
- T/T, Paypal
- Incoterm:
- FOB, CIF, EXW
- Min. Order:
- 1000 Bag/Bags
- Min. Order:
- 1000 Bag/Bags
- Delivery Time:
- 14 Days
- Transportation:
- Ocean, Air
- Port:
- SHENZHEN, SHENZHEN
Quantity:
Your message must be between 20 to 2000 characters
Contact NowBasic Info
Basic Info
Place of Origin: | China |
---|---|
Productivity: | 10000K/month |
Supply Ability: | 10000K/month |
Payment Type: | T/T,Paypal |
Incoterm: | FOB,CIF,EXW |
Certificate: | ISO9001 |
HS Code: | 8536909000 |
Transportation: | Ocean,Air |
Port: | SHENZHEN,SHENZHEN |
Product Description
Product Description
Shenzhen Antenk Electronics Co., Ltd. promoted a TSIM Series 1.85mm Height Connector
ATK-TSIMX185A003
Notes:
1.Material:
Insulator:High Temperature Thermoplatic UL
94V-0 LCP Color:black
Contact:Copper Allcy T=0.15
SHELL:SUS304
Slider:LCP Color :black
2.PLATING:
Contact:Plating 50U" Ni Overall
Plated Au Selective Contact Area
Plated 70u"-100u"Sn Over Ni On SOLDER Area
Shell:Plated 30u"Ni Ocerall MIN
Plated 1U"Au Selective Contact Area
3.1.Electrical Characteristics:
3.1 Current Rating:0.5A AC/DC Max
3.2 Voltage Rating:125V AC/DC
3.3 Ambient Temperature Range:-20℃ to +60℃
3.4 Storage Temperature Range:-40℃ to +70℃
3.5 Ambient Humidity Rang:95% R.H Max
3.6 Contact Resistance:100mΩ max
3.7 Insulation Resistance:1000MΩ min./500VDC
3.8 Mating Cycle:5000 Insertions
3.9 Temperation Cycles:260°C °C S<1,70>°C S<1,70>+5°C/-5°C

1.Material:
Insulator:High Temperature Thermoplatic UL
94V-0 LCP Color:black
Contact:Copper Allcy T=0.15
SHELL:SUS304
Slider:LCP Color :black
2.PLATING:
Contact:Plating 50U" Ni Overall
Plated Au Selective Contact Area
Plated 70u"-100u"Sn Over Ni On SOLDER Area
Shell:Plated 30u"Ni Ocerall MIN
Plated 1U"Au Selective Contact Area
3.1.Electrical Characteristics:
3.1 Current Rating:0.5A AC/DC Max
3.2 Voltage Rating:125V AC/DC
3.3 Ambient Temperature Range:-20℃ to +60℃
3.4 Storage Temperature Range:-40℃ to +70℃
3.5 Ambient Humidity Rang:95% R.H Max
3.6 Contact Resistance:100mΩ max
3.7 Insulation Resistance:1000MΩ min./500VDC
3.8 Mating Cycle:5000 Insertions
3.9 Temperation Cycles:260°C °C S<1,70>°C S<1,70>+5°C/-5°C

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